Die Bonder Servo Drive

SEA MOTION die bonder servo drive is a core motion control component specially optimized for semiconductor packaging equipment, standing out from traditional servo drives with ultra-compact size and superior comprehensive performance. Powered by DSP+FPGA dual-core architecture, it features ultra-fast response, wide bandwidth and high linearity, ensuring precise and stable operation of high-precision equipment.

The product supports mainstream encoder feedback modes including incremental-absolute dual feedback and resolver-absolute dual feedback, and is equipped with complete IO interface and STO safety function, with a low-temperature resistance of -45℃ to adapt to complex working conditions. Relying on independent R&D strength, we implement rigorous layered quality control: each PCB assembly layer undergoes independent testing, with more than ten detection procedures from production to warehousing to eliminate defective products. With a mature domestic supply chain system, this die bonder servo drive supplier provides fast delivery, flexible customization and cost-effective supporting services for global semiconductor equipment manufacturers.

Product Parameter

Product feature And Application

Driven by the accelerating localization trend of domestic semiconductor packaging equipment, domestic die bonder machines have achieved rapid iteration in precision and efficiency, creating huge market demand for high-performance domestic servo drives. SEA MOTION die bonder servo drive perfectly adapts to the core operating requirements of high-end die bonders, solving the pain points of bulky size, slow response and high failure rate of traditional imported drives. Its core advantages lie in miniaturization and high current output, enabling flexible embedded installation in equipment shells, bases and brackets only with standardized heat dissipation design, greatly optimizing equipment structural layout. In terms of performance, the dual-core architecture realizes ultra-high precision motion control, effectively improving die bonding accuracy and packaging yield.

Beyond die bonders, it is widely applicable to wafer handling machines, dicing machines, chip mounters and probe stations. Compared with imported products, our products feature stable performance and lower overall procurement and maintenance costs, helping domestic equipment manufacturers reduce reliance on foreign core components, empower the localized upgrading of semiconductor packaging equipment, and deliver high-cost-performance solutions for mid-to-high-end semiconductor packaging scenarios.

Interface definition of die bonder servo drive SEA1-80A

Product size / mm

Product structure

Necessary cables for product debugging.

Products video